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Epoxy Parfilm is recommended for epoxy resins. Its highly effective, micro-thin, film-forming application offers a better release than polyvinyl alcohol or wax. Its micro-thin film maintains the fidelity of the cast piece and affords better surface reproduction and finish. Heat stable to 635ºF.
An excellent mold release for removing epoxy parts out of molds. Also useful for removing silicone encapsulated appliances out of molds. Paintable mold release.